Atomic Layer Deposition for Surface Modifications and Solid Film Fabrication

Thumbnail Image
Journal Title
Journal ISSN
Volume Title
University of Alabama Libraries

Along with the unceasing development of the surface and material science, modification of substrates surfaces in nanoscale, to fabricate the functional materials with precisely controlled dimensions, refined composition and desired properties becomes crucial. In this report, atomic layer deposition (ALD), a vapor phase, sequential and self-limiting deposition process, has been used as an alternative strategy to modify the surface of materials and fabricates nanometer or micrometer level of functional materials with precise control. In the first part of this dissertation, ALD was used to modify the surface of the shape-engineered nanocrystals (SENCs), which enhanced the thermal stability of the SENCs from 300˚C to 700˚C and enhanced the catalytic activities of the nanocrystals as well. We also proposed a new reaction mechanism of metal-organic precursor with oxide surface, in which the conventional layered ALD growth does not happen but the oxide surface was modified via controlled metal doping. In the second part of this dissertation, ALD precursors were used to reacting with liquid substrates to fabricate freestanding solid thin films. Benefits from the unique reaction mechanism of the ALD metal-organic precursors, the thickness and the compositions of the fabricated films can be controlled. The fundamental of gas-liquid reaction has been discussed in this study. In the third part of this dissertation, area-selective ALD (AS-ALD) has been reported using carboxylic acid self-assembled monolayer as a growth inhibitor. Excellent selectivity of AS-ALD has been achieved by using this method, which could potentially be used in microfabrication as a substitution step for photolithography.

Electronic Thesis or Dissertation