Browsing by Author "Kanada, Isao"

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    The growth temperature and measurement temperature dependences of soft magnetic properties and effective damping parameter of (FeCo)-Al alloy thin films
    (American Institute of Physics, 2018-01-05) Ariake, Yusuke; Wu, Shuang; Kanada, Isao; Mewes, Tim; Tanaka, Yoshitomo; Mankey, Gary; Mewes, Claudia; Suzuki, Takao; University of Alabama Tuscaloosa; TDK Corporation
    The soft magnetic properties and effective damping parameters of Fe73Co25Al2 alloy thin films are discussed. The effective damping parameter alpha(eff) measured by ferromagnetic resonance for the 10 nm-thick sample is nearly constant (approximate to 0.004 +/- 0.0008) for a growth temperature T-s from ambient to 200 degrees C, and then tends to decrease for higher temperatures and alpha(eff) is 0.002 +/- 0.0004 at T-s = 300 degrees C. For the 80 nm-thick sample, the alpha(eff) seems to increase with T-s from alpha(eff) = 0.001 +/- 0.0002 at T-s = ambient to alpha(eff) = 0.002 +/- 0.0004. The alpha(eff) is found nearly constant (alpha(eff) = 0.004 +/- 0.0008) over a temperature range from 10 to 300 K for the 10 nm films with the different T-s (ambient, 100 and 200 degrees C). Together with an increasing non-linearity of the frequency dependence of the linewidth at low Ts, extrinsic contributions such as two-magnon scattering dominate the observed temperature dependence of effective damping and linewidth. (C) 2018 Author(s).
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    The Growth Temperature and Measurement Temperature Dependences of Soft Magnetic Properties and Effective Damping Parameter of (FeCo)-Al Alloy Thin Films
    (2018) Ariake, Yusuke; Wu, Shuang; Kanada, Isao; Mewes, Tim; Tanaka, Yoshitomo; Mankey, Gary; Mewes, Claudia; Suzuki, Takao; University of Alabama Tuscaloosa
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    Soft Magnetic Properties and Damping Parameter of (FeCo)-Al Alloy Thin Films
    (2017) Kanada, Isao; Cruce, Alex; Mewes, Tim; Wu, Shuang; Mewes, Claudia; Mankey, Gary; Suzuki, Takao; University of Alabama Tuscaloosa
    For high frequency device applications, a systematic study of the soft magnetic properties and magnetization dynamics of (FeCo)-Al alloy thin films has been carried out. A low effective damping parameter αeff of 0.002 and a high saturation magnetization of about 1,800 emu/cc are obtained at y=0.2∼0.3 for (Fe1-yCoy)98Al2 alloy thin films deposited onto fused silica and MgO(100) at an ambient temperature during deposition. Those films are of the bcc structure with the <110> orientation normal to the film plane. They possess a columnar structure, grown along the film normal. The column width is found to be about 20 nm for y=0.25. It is concluded that the (FeCo)-Al thin films with a damping parameter as low as 0.002 and high saturation magnetization of about 1,800 emu/cc have been successfully fabricated, and that they are potential for future high frequency device applications.
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    Soft magnetic properties and damping parameter of (FeCo)-Al alloy thin films
    (American Institute of Physics, 2017-02-06) Kanada, Isao; Cruce, Alex; Mewes, Tim; Wu, Shuang; Mewes, Claudia; Mankey, Gary; Suzuki, Takao; University of Alabama Tuscaloosa; TDK Corporation
    For high frequency device applications, a systematic study of the soft magnetic properties and magnetization dynamics of (FeCo)-Al alloy thin films has been carried out. A low effective damping parameter alpha(eff) of 0.002 and a high saturation magnetization of about 1,800 emu/cc are obtained at y=0.2 similar to 0.3 for (Fe1-yCoy)(98)Al-2 alloy thin films deposited onto fused silica and MgO(100) at an ambient temperature during deposition. Those films are of the bcc structure with the <110> orientation normal to the film plane. They possess a columnar structure, grown along the film normal. The column width is found to be about 20 nm for y=0.25. It is concluded that the (FeCo)-Al thin films with a damping parameter as low as 0.002 and high saturation magnetization of about 1,800 emu/cc have been successfully fabricated, and that they are potential for future high frequency device applications. (C) 2017 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).